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VS-UHF-PT-305 T3-T6 - Sn96.5Ag3.0Cu0.5 lead-free halogen-free ultra-low-voiding no-clean pin testable rosin solder paste 3% silver SAC305 (ROL0) F 5% for high-density stencil printing

VS-UHF-PT-305 T3-T6 - Sn96.5Ag3.0Cu0.5 lead-free halogen-free ultra-low-voiding no-clean pin testable rosin solder paste 3% silver SAC305 (ROL0) F 5% for high-density stencil printing

Name: VS-UHF-PT-305 T3-T6 - Sn96.5Ag3.0Cu0.5 lead-free halogen-free ultra-low-voiding no-clean pin testable rosin solder paste 3% silver SAC305 (ROL0) F 5% for high-density stencil printing
Brand: schmucketriebe.at
SKU: 4260925549
Price: 16.32 USD
Availability: InStock
Rating: 4.4797 (23 reviews)

SKU: 4260925549

4.5

USD16.32 USD53.32

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Ships within 48 hours · Estimated delivery Aug 10 - Aug 15

Live Spec

VS-UHF-PT-305 T3-T6 - Sn96.5Ag3.0Cu0.5 lead-free halogen-free ultra-low-voiding no-clean pin testable rosin solder paste 3% silver SAC305 (ROL0) F 5% for high-density stencil printingVS UHF PT 305 Sn96. 5Ag3. 0Cu0. 5 lead free halogen free ultra low voiding no clean pin testable rosin solder paste 3% silver SAC305 (ROL0) IPC designation: ROL0 (no clean). REACH complaint LGA, BGA, CSP assembly. Halogen free per EN14582 method ZERO Halogen. Ultra Low voiding. Clear residue. Optimal viscosity. Superior dispensing, stencil printing, pin transfer. Sharp definition at high speeds. Universal for most PCB finishes. Long stencil life Easy

Store: schmucketriebe.at · Domain: schmucketriebe.at

Description

5% for high-density stencil printing

eliminating false failures in high-throughput ATE testing environments

Fit: Regular

Excessive reflow temperature: High temperatures can cause the solder spheres to melt excessively

Exchange/Return Notes